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Semitool Raider ECD
The RAIDER electroplating systems for 150mm - 300mm single wafer, automated, multi-chamber, electrochemical deposition system delivering the highest throughput in the smallest footprint available.
Electroplating on 300mm wafers using the advanced CFD reactor which is able to dynamically change the current density for unmatched uniformity. Electroplating on ultra-thin and resistive seed layers are now achievable with the multi-zoned Anode array.