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Rudolph MetaPULSE II 200 X Thickness Measurement System, s/n 200MP11-1608-AW-11.
The MetaPULSE X Cu supports all aluminum interconnect processes and the silicides, ultra-thin barriers, and tungsten processes in addition to the barrier, seed, and electroplated copper processes used in advanced dual-damascene processes. Both are available in 200mm and 300 mm configurations. This provides a cost effective opaque film metrology roadmap for any customer moving from today's 200 mm aluminum interconnect processes to next-generation 300 mm and dual damascene semiconductor production.
