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Rotary Wafer Etching System Specifications:
Production Capacity- Up to 50 6 inch wafer and Up to 25 8 inch wafers
Agitation is accomplished by axial rotation of wafers, variable over a range of 0-80 rpm.
Process time set with range of 0-9999 seconds or 0.0-999.9
Quick Dump Cycle
Process Temp Ambient to 100 degrees C