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ASML 5500/300C Wafer Stepper
The PAS 5500/300C is capable of processing 88 200 mm wafers per hour. The stepper incorporates an AERIAL Illuminator, which allows extendibility beyond 0.25 µm without compromising the excellent imaging performance and high productivity. This allows quick start-up of deep UV processes needed to fabricate high-density IC’s, including: shrink 64-megabit memory chips, 256-megabit DRAMs and P6- and P7-generation microprocessors.
|
Lens |
Field Size |
Overlay |
Throughput |
|
NA |
Resolution |
Max X & Y |
2 pt. Global
Alignment |
200 mm Wafers
70 Exp., 30 mJ/cm2 |
Variable
0.40 - 0.57 |
< 250 nm |
22 X 27.4 mm |
< 45 nm |
> 88 wph |
