E-Plus Gage Technology 9650 UltraScan
Accuracy : Repeatability : Absolute Range
Thickness ± 0.25 pm [± 0.50 pm] : 0.05 pm [0.15 pm] : Nominal ± 75 pm [± 125 pm]
Global Flatness ± 0.06 pm [± 0.15 pm] : 0.02 pm [0.05 pm]
Site Flatness ± 0.06 pm [± 0.15 pm] :90% of sites: 0.011 pm [0.05 pm]
10% of sites: 0.025 pm [0.05 pm]
Shape (Bow/Warp) ± (1.5 + 3% of reading): (0.5 + 1% of reading) : pm ±75 pm [±150 pm]
Resistivity: Low ±2% : 0.007 ohm-cm : 0.001 -0.999 ohm-cm
High ± 2% : 0.002 ohm-cm : 0.2 - 199.9 ohm-cm
Dual ± 5% : 0.009 ohm-cm : 0.001 - 99.9 ohm-cm
ADE's patented E-Plus Gage technology uses opposing
capacitive probes to quickly measure thousands of shape and
thickness points without touching the wafer surface. The
result: fast, high-resolution characterization of both patterned
and polished wafers without the limitations of optical or pneumatic
methods.
All accuracy and repeatability specifications reported for a 200 mm wafer of 725 pm nominal thickness with 0.25 pm SUR and a 9 ohm-cm resistivity.
Supported SEMI/JEIDA Wafer Geometries
Wafer diameters supported: 150 mm and 200 mm (polished or patterned)
Wafer thickness: 400 pm to 1,000 pm
Notches, Flats (Primary/Secondary): Up to four (4) per SEMI and JEIDA standards
Edge Exclusion: To 3 mm from edge (2 mm optional)
Data Density and Throughput
Number of thickness/shape data points: Up to 17,300 points
Throughput using optional handler: 45 - 70+ wafers/hour (depends on wafer size, measurement pattern and mode)
Measurement and Sorting
Measurements: Thickness: Center point, Five point, Full wafer scan
Shape: Bow and Warp using 3-Point or Best-Fit references
Global Flatness: SEMI GBI, TIR, FPD, FPD%, 5-Point TTV
Site Flatness: All SEMI M1 standards with 8 - 30 mm site size and variable offsets
Resistivity: Low, high, Dual range configurations
Type (optional): N, P, or undetermined
Sorting: Numerous binning options for up to two (2) cassettes based on thickness, shape, global and site flatness
Facilities and Safety
Compliance:
Approximate Dimensions & Weight:
Power and Facilities Requirements:
Controller:
CE
129 x 99 x 115 cm (LWH), 383 kg (Measurement subsystem only)
Configurable from 200 to 240 VAC @ 50/60 Hz (4.8 kVA peak usage), Vacuum
UNIX operating system with character-based User Interface
